Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...

The eBeam Initiative’s annual lunch at SPIE Advanced Lithography and Patterning has long served as a focal point for eBeam technology education for the industry. This year marked our 17th gathering, ...

Key Takeaways: There is no single processor capable of executing everything efficiently, meaning that multiple processors are required. Maximum efficiency is gained by minimizing the movement of data.

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking ...

AI is becoming part of the everyday work of IP developers who build, verify, package, support, and sell reusable design blocks. It also is changing what the IP does, how it’s created, verified, and ...

Expanding beyond traditional block-based SSD access with new command sets, broader media support, and improved transport ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.

As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads.

The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent can do, how much time it saves, and which parts of the workflow it can automate. That is ...